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| SEALING & ADHESION |
Silicones are used in a wide array of applications for bonding components,
and sealing against moisture or environmental contaminants. A comprehensive portfolio of 1 Part and 2 Part Adhesives and Sealants, many of which are excellent candidates for assembly applications on or near sensitive electrical and electronic components, are available. These materials are applied by a variety of methods ranging from manual dispensing to auto-dispensing units for tube, cartridge, pail, or drum packages. Mixing for 2 Part grades may be accomplished by either manual processes or meter mix dispensing, depending on production volume and post-mix material properties. |
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Performance Considerations
- Temperature Resistance - Dielectric Resistance
- Flame Retardancy - Low Volatility
- Adhesion - Mechanical Strength
- Hardness - Thermal Conductivity
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Process Considerations
- Viscosity - Cure Mechanism
- Cure Temperature - Cure Time
- Pot Life |
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| COATING |
| The Coating process involves the application of silicone in a thin protective layer to a component surface by methods such as dip, flow, spray, and selective robotic coating. Selection of a silicone coating material for a particular application involves the consideration of various performance and processing criteria. |
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Performance Considerations
- Temperature Resistance - Dielectric Resistance
- Flame Retardancy - Low Volatility
- Stress Relief
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Process Considerations
- Viscosity - Cure Mechanism
- Cure Temperature - Cure Time
- Pot Life |
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| POTTING & ENCAPSULATION |
| Silicone rubber and gels are widely used in electronics to ensure mechanical and environmental protection. A full range of products are offered in various cure speeds, viscosities, and performance, many of which offer enhancements for thermal cycling protection, stress relief, material strength, flame retardancy, or optical clarity. |
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Performance Considerations
- Temperature Resistance - Dielectric Resistance
- Flame Retardancy - Low Volatility
- Adhesion - Stress Relief
- Release Properties - Thermal Conductivity
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Process Considerations
- Viscosity - Cure Mechanism
- Cure Temperature - Cure Time
- Pot Life |
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